The LED Chip Industry
LED chips, the English called CHIP, it is the production of LED lamps and lanterns (LEDLAMP), LED screen (LEDDISPLAY), LED backlight (LEDBACKLIGHT) the main material, the material of arsenic (AS), aluminum (AL), gallium (Ga), indium (IN), phosphorus (P) and nitrogen (N), strontium (Si) these elements IN the number of species composition, its internal structure with unidirectional conductivity.
Will DianZhuan into light, this is the physics of LED chips can shine.
LED chip is a semiconductor chip, chip attached on a bracket, at the end of the end is negative, the other end connected to the power of the anode, the whole chip is encapsulated by epoxy resin. Semiconductor chip consists of two parts, one part is a p-type semiconductor, dominated by holes in it, the other end is n-type semiconductor, here is mainly electronic. This two kinds of semiconductor connected, between them to form a p-n junction. When a current flows through a wire to the chip, the electron will be pushed P area, electron and holes in the P zone compound, then will be issued in the form of photon energy, this is the principle of light-emitting LED chip.
General brightness: R (red GaAsP 655 nm), H (high GaP 697 nm), G (565 nm) green GaP, Y (yellow GaAsP/GaP 585 nm), E (635 nm) orange GaAsP/GaP, etc.;
High brightness: VG (a light green GaP 565 nm), VY (a bright yellow GaAsP/GaP 585 nm), SR (a bright red the GaA/AS 660 nm).
Ultra-high brightness: UG, UY, UR, UYS, URF, UE, etc.;
Not visible (infrared) : IR, SIR, VIR, HIR;
According to the application:
According to use can be divided into high power LED chips, two small power LED chip;
High power LED chips generally divided into 38 * 38 mil, 40 * 40 mil, 45 * 45 mil, etc.
Low power chips generally divided into 9 mil mil, 8, 12 mil, 14 mil, etc.
Mil is a unit size, a mil is one over one thousand of an inch. 40 mil is about 1 mm. 38 mil, 40 mil, 45 mil is common sizes of 1 w high power chip. Theoretically, the bigger the chip, can withstand the greater the current, and power. But the chip material and process are the main factors influencing the power of chip size.
According to color: mainly divided into three types: red, green, blue (raw materials of producing white light).
According to the shape: generally divided into two kinds of square piece, wafer.
In order to avoid dress Chip for electrode from light emitting area and the luminous efficiency, Chip developers inversion structure was designed, which suits the Chip inversion, inspire the light-emitting layer of light directly from the other side of the electrode (substrate was stripped, Chip material is transparent), at the same time, convenient for Flip Chip design LED assembly house structure of the welding line, thus, the whole Chip called a Flip Chip (Flip Chip), the structure is more used in high power Chip.
Flip chip does not need to wire bonding, can achieve strong and the thinnest encapsulation, low thermal resistance, which can realize high current characteristics. Using inversion technology, can be realized on the chip level of different size, color, shape, power chip integration, realize the super power module products, this is the advantage of any other chip technology cannot achieve.